FEP Ew-321, Wire& Cable Which Require Better Stress Crack Resistance,

• CAS No.: Na
• Formula: Na
• EINECS: Na
• Molecular Principal Chain: FEP
• Color: White
• Melt Flow Rate(Mfr) G/10min: 20.1-36.0
• Model NO.: FEP EW-321
• Breaking Strength ≥ MPa: 22.0
• Elongation ≥%: 320
• Melting PointºC: 255±10
• Specific Gravity: 2.12-2.17
• Dielectric Constant(106Hz) ≤: 2.15
• Dissipation Factor(106Hz) ≤: 7.0X10(-4)
• Transport Package: 25kg/Bag
• Specification: 25KG/BAG
• Trademark: LABEYOND
• Origin: China

Product Description

Fluorinated Ethylene-Propylene Resin (FEP) is a copolymer of TFE and HFP with good thermal stability, outstanding chemical inertness, good electrical insulation and low friction coefficient. It can be processed by thermoplastic processing method.
Application: EW-321 is produced by new process and ingredients. With improved physical performance, EW-321 is mainly used for wire& cable which require better stress crack resistance, aerospace wire & cable and thin-walled tube etc.

NO.	Item	Unit	Value	Test Method
1	Melt Flow Rate(MFR)	g/10min	8.1-12.0	ASTM D2116
2	Breaking Strength ≥	MPa	25.0	ASTM D638
3	Elongation ≥	%	330	ASTM D638
4	Melting Point	ºC	255±10	ASTM D3418
5	Specific Gravity	/	2.12-2.17	ASTM D792
6	Dielectric Constant(10^6Hz)  ≤	/	2.15	ASTM D150
7	Dissipation Factor(10^6Hz)  ≤	/	7.0x10^-4	ASTM D150
8	MIT≥	Cycles	16000	ASTM D2176

Recommended processing conditions
Equilibrium Ratio (DDR): 40-100
Extruding Machine L/D: 25:1-30:1          DRB: 1.0-1.03
Screw Compression Ratio: 3:1              Extrusion Speed: 50-80m/min
Extruding Machine Material:
It is corrosive to most metals, and anti-corrosion materials are suggested for extruding machines, such as: HAC-276
 

Zone 1 (ºC)	Zone 2 (ºC)	Zone 3(ºC)	Flange(ºC)	Head(ºC)	Die(ºC)	Cooling
290-310	320-340	350-370	370-380	375-385	375-385	Air/Water

Package: It is packed in PE bag and put in paper drum or double-layer reinforced plastic bag. Normal package is net wt. 25kgs/package and also accept customization.
Storage: Stored in clean, cool and dry places; avoid direct sunlight, moisture and dust.